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Direct Imaging for PCB Solder Mask

KST's leading direct imaging (DI) solutions for solder mask (SM) deliver high accuracy, high quality imaging and high throughput for any solder mask design, from the simplest to the most complex. These high-capacity, field-proven solutions for mass production leverage KST unique proprietary technologies to ensure consistently high imaging quality with a low total cost of ownership.

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No.

Item

KST-DI2428-6FEB

KST-DI2428-12FEB

1

PCB size(Max)

24.5"* 28.5"

24.5 inch * 28.5 inch

2

PCB size(Min)

24.5" * 21 "Clampable

12 " * 12 "Non Clampable

24.5 inch * 21 inchClampable

12 inch * 12 inchNon Clampable

3

PCB Thickness

0.15 - 4.0mm

4

Clamp Structure

Yes

5

Bridge and Opening Size

Green ink Bridge :50um / Solder Mask Opening 75um

6

Light Source depth of field

±300um

7

Alignment Accuracy

±15um

8

Processing Speed

24.5"*28.5" PCB   

TAIYO INK 1 – 1.5 side /min   

High sensitive ink 2 side/min

24.5inch*28.5inch PCB   

TAIYO INK 2 – 2.5 side /min   

High sensitive ink 3~3.5 side/min

9

Sensitive material

TAIYO INK; Special ink for DI